ElecGear CPU Contact Frame for AMD Ryzen 7000, 8000, 9000 Desktop Processor, Aluminum Mod ILM for AMD AM5 LGA1718 Socket, Replacement CPU Fixing Buckle with Thermal Paste Guard

Anti-bending Bracket for AMD Ryzen 7000, 8000, 9000 Series
Aluminum Frame ensures CPU is perfectly Flat in AM5 Socket
Silicone Guard prevent Thermal Paste bleeding onto CPU PCB
Anodized Aluminum and High Temp Pads deliver the Stability
Screws and Heatsink Thermal Paste, T20 Screwdriver included

Specifications:
Brand: ElecGear
Model: LGA1718-AL
Dimension: 70x56x7.1mm
Weight: 31gram
Finish: Aluminum Oxidation
Color: Gray
Compatibility:
AMD Ryzen 7000, 8000, 9000 and X3D series processors

What’s in Package:
1x Anti-bending Contract Frame (AMD Aluminum Version)
1x Silicone CPU Guard
4x Customized Screws
1x Thermal Paste (6.5W/m-K, 1.3gram)
1x T20 Screwdriver

[AMD AM5 Contact Frame] – The fixing buckle evenly distributes the pressure on the entire edge of heat spreader. The precision CNC machined bracket ensures CPU is perfectly flat when installed in AM5 LGA1718 socket, preventing it from flexing the middle edges down. Works with AMD Ryzen 7000, 8000, 9000 and X3D series processors
[Internal Thermal Paste Guard] – The silicon wrap tightly enclosures the entire CPU around the 8 notches. It gives a soft touch onto the IHS and prevents thermal paste bleeding onto the capacitors and printed circuit board of CPU. Made of silicon withstanding 260℃ high temperature for most stability. The bottom insulating pads are ready for electronic safe contact with mother board
[Bending Issue of LGA1718 Buckle] – Again, like Intel’s 12th and 13th LGA1700, we did notice some 0.1mm warp at the middle edges of IHS. AMD thickened its IHS, however they cut it with 8 large notches which greatly weaken the strength. The stock LOTES buckle places tremendous pressure on the middle that causes the top to bend. It’s no good for heat contact with heatsink block
[Special Screws and T20 screwdriver] – 4x replacement screws and T20 trox screwdriver are included for easy teardown and assembly. The thermal compound is the ideal CPU heatsink grease with high thermal conductivity (6.5W/m-K), low thermal resistance, metal-free, non-bleeding and easy to apply